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DATE 2009 Friday Workshop on
3D Integration
-Technology, Architecture, Design, Automation, and Test-

April 24, 2009
Palais des Congrès Acropolis - Nice, France

http://www.date-conference.com/

CALL FOR PAPERS
Scope -- Workshop Description -- Topic Areas -- Submissions -- Key Dates -- Additional Information

Scope DATE

The Design, Automation, and Test in Europe conference and exhibition is the main European event bringing together designers and design automation users, researchers and vendors, as well as specialists in hardware and software design, test and manufacturing of electronic circuits and systems. The conference includes plenary invited papers, regular papers, panels, hot-topic sessions, tutorials and workshops, two special focus days, and a track for executives. Friday Workshops are focusing on emerging research and application topics. At DATE 2009, one of the Friday Workshops is devoted to 3D Integration. This one-day event consists of a plenary keynote, regular and poster presentations, and a panel session.

Workshop Description

The Design, Automation, and Test in Europe conference and exhibition is the main European event bringing together designers and design automation users, researchers and vendors, as well as specialists in hardware and software design, test and manufacturing of electronic circuits and systems. The conference includes plenary invited papers, regular papers, panels, hot-topic sessions, tutorials and workshops, two special focus days, and a track for executives. Friday Workshops are focusing on emerging research and application topics. At DATE 2009, one of the Friday Workshops is devoted to 3D Integration. This one-day event consists of a plenary keynote, regular and poster presentations, and a panel session.
Topic Areas
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You are invited to participate and submit your contributions to the DATE 2009 Friday Workshop on 3D Integration. The area of interest includes (but is not limited to) the following topics:

  • 3D technologies: wire-bonding, micro-bumping, contactless, and through-silicon-vias interconnect
  • 3D design space exploration
  • Architectures for 3D integration
  • 3D combinations of logic, memory, analog, RF
  • 3D design methods and EDA tools
  • Signal integrity and noise coupling in 3D
  • Thermal analysis and thermal-aware design
  • Test, design-for-test, and debug techniques
  • Product or test chip case studies
  • Economic benefit/cost trade-off studies
  • Standardization initiatives

Submissions

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Submissions are invited in the form of (extended) abstracts not exceeding two pages and must be sent in as PDF file to yann.guillou@stnwireless.com and geert.vanderplas@imec.be with “DATE09-3D-WS” as subject.

All submissions will be evaluated for selection with respect to their suitability for the workshop, originality, and technical soundness. Selected submissions can be accepted for regular or poster presentation. At the workshop, an Electronic Workshop Digest will be made available to all workshop participants, which will include all material that authors are willing to provide: abstract, paper, slides, poster, etc.

Key Dates

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Paper Submission deadline: November 8, 2008
Notification of Acceptance: November 17, 2008
Camera-Ready Material due: April 10, 2009

Additional Information
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Erik Jan Marinissen – General Chair
IMEC
Nomadic Embedded Systems
Kapeldreef 75
3001 Leuven, Belgium
E-mail: erik.jan.marinissen@imec.be

Yann Guillou – Program Co-Chair
ST-NXP Wireless
Wireless Multimedia Division
12, rue Jules Horowitz – BP 217
38019 Grenoble cedex, France
E-mail: yann.guillou@stnwireless.com
Geert Van der Plas – Program Co-Chair
IMEC
Nomadic Embedded Systems
Kapeldreef 75
3001 Leuven, Belgium
E-mail: geert.vanderplas@imec.be
For more information, visit us on the web at: http://www.date-conference.com/

The Design, Automation and Test in Europe Conference and Exhibition (DATE 2009) is sponsored by the European Design and Automation Association, the EDA Consortium, the IEEE Computer Society (TTTC), (CEDA), ECSI, RAS and ACM SIGDA.


IEEE Computer Society- Test Technology Technical Council

TTTC CHAIR
Adit D. SINGH
Auburn University - USA
Tel. +1-334-844-1847
E-mail adsingh@eng.auburn.edu

PAST CHAIR
André IVANOV
University of British Columbia - Canada
Tel. +1-604-822-6936
E-mail ivanov@ece.ubc.ca

TTTC 1ST VICE CHAIR
Michael NICOLAIDIS
TIMA Laboratory - France
Tel. +33-4-765-74696
E-mail michael.nicolaidis@imag.fr

SECRETARY
Christian LANDRAULT
LIRMM - France
Tel. +33-4-674-18524
E-mail landrault@lirmm.fr

ITC GENERAL CHAIR
Doug J. YOUNG
SV Probe Inc.
- USA
Tel.
E-mail dyoung@svprobe.com

TEST WEEK COORDINATOR
Yervant ZORIAN
Virage Logic Corporation - USA
Tel. +1-510-360-8035
E-mail yervant.zorian@viragelogic.com

TUTORIALS AND EDUCATION
Dimitris GIZOPOULOS

University of Piraeus
- Greece
Tel. +30-210-414-2372
E-mail dgizop@unipi.gr

STANDARDS
Rohit KAPUR

Synopsys
, Inc. - USA
Tel. +1-650-934-1487
E-mail rkapur@synopsys.com

EUROPE
Zebo PENG
Linköping University - Sweden
Tel. +46-13-282-067/-281-000
E-mail zpe@ida.liu.se

MIDDLE EAST & AFRICA
Ibrahim HAJJ
American University of Beirut - Lebanon
Tel. +961-1-341-952
E-mail ihajj@aub.edu.lb

STANDING COMMITTEES
André IVANOV
University of British Columbia - Canada
Tel. +1-604-822-6936
E-mail ivanov@ece.ubc.ca

ELECTRONIC MEDIA
Alfredo BENSO
Politecnico di Torino - Italy
Tel. +39-011-564-7080
E-mail alfredo.benso@polito.it

 

PRESIDENT OF BOARD
Yervant ZORIAN
Virage Logic Corporation- USA
Tel. +1-510-360-8035
E-mail yervant.zorian@viragelogic.com

SENIOR PAST CHAIR
Paolo PRINETTO
Politecnico di Torino - Italy
Tel. +39-011-564-7007
E-mail Paolo.Prinetto@polito.it

TTTC 2ND VICE CHAIR
Chen-Huan CHIANG

Alcatel-Lucent
- USA
Tel. +1-973-386-6759
E-mail chenhuan@alcatel-lucent.com

FINANCE
Michael NICOLAIDIS
TIMA Laboratory - France
Tel. +33-4-765-74696
E-mail michael.nicolaidis@imag.fr

IEEE DESIGN & TEST EIC
K.T. (Tim) CHENG
University of California, Santa Barbara - USA
Tel. +1-805-893-72942
E-mail timcheng@ece.ucsb.edu

TECHNICAL MEETINGS
Chen-Huan CHIANG
Alcatel-Lucent
- USA
Tel. +1-973-386-6759
E-mail chenhuan@alcatel-lucent.com

TECHNICAL ACTIVITIES
Matteo SONZA REORDA
Politecnico di Torino - Italy
Tel.+39-011-564-7055
E-mail matteo.sonzareorda@polito.it

ASIA & PACIFIC
Kazumi HATAYAMA
STARC - Japan
Tel. +
E-mail hatayama.kazumi@starc.or.jp

LATIN AMERICA
Victor Hugo CHAMPAC
Instituto Nacional de Astrofisica - Mexico
Tel.+52-22-470-517
E-mail champac@inaoep.mx

NORTH AMERICA
William R. MANN
SW Test Workshop - USA
Tel. +1-949-645-3294
E-mail william.mann@ieee.org

COMMUNICATIONS
Cecilia METRA
Università di Bologna - Italy
Tel. +39-051-209-3038
E-mail cmetra@deis.unibo.it

INDUSTRY ADVISORY BOARD
Yervant ZORIAN
Virage Logic Corporation- USA
Tel. +1-510-360-8035
E-mail yervant.zorian@viragelogic.com


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